Invention Grant
- Patent Title: Light emitting device package
- Patent Title (中): 发光装置封装
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Application No.: US13106066Application Date: 2011-05-12
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Publication No.: US09041043B2Publication Date: 2015-05-26
- Inventor: HaeKyung Lee , ChoongYoul Kim , HyunGoo Kang , KiHo Hong
- Applicant: HaeKyung Lee , ChoongYoul Kim , HyunGoo Kang , KiHo Hong
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: KED & Associates LLP
- Priority: KR10-2010-0044608 20100512
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L25/075 ; H01L33/48 ; H01L33/56 ; H01L33/60

Abstract:
A light emitting device package is provided that comprises first and second light emitting devices including light emitting diodes, a body a body having a first cavity in which the first light emitting device is positioned and a second cavity in which the second light emitting device is positioned and a resin material formed in the cavity, wherein the resin material includes, a first resin material formed in the first cavity, a second resin material formed in the second cavity, and a third resin material formed an upper surface of the first and second resin materials, wherein at least one of the first resin material and the second resin material includes a light diffusing material.
Public/Granted literature
- US20110222278A1 LIGHT EMITTING DEVICE PACKAGE Public/Granted day:2011-09-15
Information query
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