A light-emitting device having a light source die mounted within an aperture is disclosed. The aperture is covered by a die attach pad on one side. The light source die is mounted on a die attach pad within the aperture. In one embodiment, an optical coupling layer can be formed within an aperture encapsulating a light source die. A wavelength converting layer can be formed on the substrate above the optical coupling layer. The wavelength converting layer can comprise a high density layer and a low density layer. The high density layer can comprise wavelength-converting material precipitated on one side of the wavelength converting layer. The low density layer can comprise the wavelength-converting material in particle form suspended within the wavelength converting layer. In one embodiment, the wavelength converting layer may be confined within the aperture of the substrate.