Invention Grant
- Patent Title: Multilayered circuit type antenna package
- Patent Title (中): 多层电路式天线封装
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Application No.: US13531120Application Date: 2012-06-22
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Publication No.: US09041074B2Publication Date: 2015-05-26
- Inventor: Won-bin Hong , Alexander Goudelev , Kwang-hyun Baek , Young-hwan Kim
- Applicant: Won-bin Hong , Alexander Goudelev , Kwang-hyun Baek , Young-hwan Kim
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2011-0107059 20111019
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L23/34 ; H01Q1/38 ; H01Q5/00 ; H01Q9/04 ; H01Q1/22 ; H01Q21/00

Abstract:
A multilayered antenna package including: a radio frequency integrated circuit (RFIC) interface layer that is configured to transmit a radio frequency (RF) signal; a first dielectric layer that is disposed on the RFIC interface layer; a coplanar waveguide layer that is disposed on the first dielectric layer and is configured to receive the RF signal transmitted by RFIC layer; a second dielectric layer disposed on the coplanar waveguide layer; and an antenna portion that is disposed on the second dielectric layer and is configured to irradiate a signal that is transmitted from the coplanar waveguide layer.
Public/Granted literature
- US20130099389A1 MULTILAYERED CIRCUIT TYPE ANTENNA PACKAGE Public/Granted day:2013-04-25
Information query
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