Invention Grant
- Patent Title: Superjunction semiconductor device and manufacturing method therefor
- Patent Title (中): 超结半导体器件及其制造方法
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Application No.: US14248159Application Date: 2014-04-08
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Publication No.: US09041096B2Publication Date: 2015-05-26
- Inventor: Toshio Nakajima
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Chen Yoshimura LLP
- Priority: JP2013-085788 20130416; JP2013-101527 20130513
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66 ; H01L29/739 ; H01L29/06 ; H01L29/08

Abstract:
A semiconductor device that includes the following is manufactured: an n− base layer; a p-type base layer formed on the surface of the n− base layer; an n+ source layer formed in the inner area of the p-type base layer; a gate electrode formed so as to face a channel region across a gate insulating film; a plurality of p-type columnar regions that are formed in the n− base layer so as to continue from the p-type base layer and that are arranged at a first pitch; and a plurality of p+ collector layers that are selectively formed on the rear surface of the n− base layer and that are arranged at a second pitch larger than the first pitch.
Public/Granted literature
- US20140306283A1 SUPERJUNCTION SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR Public/Granted day:2014-10-16
Information query
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