Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13849344Application Date: 2013-03-22
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Publication No.: US09041097B2Publication Date: 2015-05-26
- Inventor: Shigeru Kusunoki
- Applicant: Shigeru Kusunoki
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JP2012-207393 20120920
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/16 ; H01L29/423 ; H01L29/739 ; H01L29/49

Abstract:
A semiconductor device includes a channel layer formed on a substrate, an insulating layer formed in contact with the channel layer, an impurity-doped first semiconductor layer formed on an opposite side of the insulating layer from the channel layer, an impurity-doped second semiconductor layer formed on an opposite side of the first semiconductor layer from the insulating layer, and a gate electrode formed on an opposite side of the second semiconductor layer from the first semiconductor layer. A quotient of an impurity density of the first semiconductor layer divided by a relative permittivity of the first semiconductor layer is greater than a quotient of an impurity density of the second semiconductor layer divided by a relative permittivity of the second semiconductor layer.
Public/Granted literature
- US20140077291A1 SEMICONDUCTOR DEVICE Public/Granted day:2014-03-20
Information query
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