Invention Grant
- Patent Title: Semiconductor devices
- Patent Title (中): 半导体器件
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Application No.: US14016965Application Date: 2013-09-03
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Publication No.: US09041143B2Publication Date: 2015-05-26
- Inventor: Yukie Nishikawa , Nobuhiro Takahashi , Hironobu Shibata
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Tokyo
- Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee Address: JP Tokyo
- Agency: Patterson & Sheridan LLP
- Priority: JP2013-061114 20130322
- Main IPC: H01L29/04
- IPC: H01L29/04 ; H01L29/417 ; H01L29/45 ; H01L29/66 ; H01L29/861

Abstract:
The semiconductor device includes a first semiconductor layer of the first conductive type, a second semiconductor layer having the cubic crystalline structure formed on the first semiconductor layer, an electrode formed on the second semiconductor layer, and a reactive region formed between the second semiconductor layer and the electrode. The second semiconductor layer includes an upper surface that is tilted from the (100) plane. The reactive region includes at least one element constituting the second semiconductor layer, at least one element constituting the electrode, and forming a protuberance extending toward the second semiconductor layer.
Public/Granted literature
- US20140284755A1 SEMICONDUCTOR DEVICES Public/Granted day:2014-09-25
Information query
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