Invention Grant
- Patent Title: Vertically integrated systems
- Patent Title (中): 垂直集成系统
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Application No.: US14041780Application Date: 2013-09-30
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Publication No.: US09041150B2Publication Date: 2015-05-26
- Inventor: Alan J. O'Donnell , Santiago Iriarte , Mark J. Murphy , Colin G. Lyden , Gary Casey , Eoin Edward English
- Applicant: Analog Devices, Inc.
- Applicant Address: US MA Norwood
- Assignee: Analog Devices, Inc.
- Current Assignee: Analog Devices, Inc.
- Current Assignee Address: US MA Norwood
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Main IPC: H01L25/16
- IPC: H01L25/16 ; H01L23/488 ; G01N27/414 ; H01L23/48 ; B81B7/00 ; G01N27/26 ; H01L27/14 ; H01L27/15 ; H01L49/02 ; H01L31/0392 ; H01F17/00 ; H01L21/82 ; H01L27/06 ; H01L23/00 ; H01F17/04 ; H02S40/38 ; H02S10/10 ; H01L31/053 ; H01L23/367 ; H01L23/38 ; H01L23/473
Abstract:
Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.
Public/Granted literature
- US20140026649A1 VERTICALLY INTEGRATED SYSTEMS Public/Granted day:2014-01-30
Information query
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