Wafer and a method of dicing a wafer

Invention Grant

US09041162B2 Wafer and a method of dicing a wafer 有权

Title translation: 晶片和切割晶片的方法

Patent Title: Wafer and a method of dicing a wafer
Patent Title (中): 晶片和切割晶片的方法
Application No.: US14188234

Application Date: 2014-02-24
Publication No.: US09041162B2

Publication Date: 2015-05-26
Inventor: Giuseppe Miccoli , Bhaskaran Jayachandran , Friedrich Steffen , Alfred Vater
Applicant: Infineon Technologies AG
Applicant Address: DE Neubiberg
Assignee: Infineon Technologies AG
Current Assignee: Infineon Technologies AG
Current Assignee Address: DE Neubiberg
Agency: Slater & Matsil, L.L.P.
Main IPC: H01L23/544
IPC: H01L23/544 ; G03F7/20 ; G03F9/00 ; H01L21/78 ; H01L23/00 ; H01L23/58 ; H01L21/66

Abstract:

A wafer includes a plurality of chips, each of the chips being spaced from each other by kerf-line regions including a reduced width.

Abstract(Chinese):

晶片包括多个芯片，每个芯片通过包括减小的宽度的切线区域彼此间隔开。

Public/Granted literature

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L23/00	半导体或其他固态器件的零部件（H01L25/00优先）
H01L23/544	.加到半导体器件上的标志，例如注册商标、测试图案