Invention Grant
US09041186B2 Encapsulated semiconductor chips with wiring including controlling chip and method of making the same
有权
具有包括控制芯片的布线的封装半导体芯片及其制造方法
- Patent Title: Encapsulated semiconductor chips with wiring including controlling chip and method of making the same
- Patent Title (中): 具有包括控制芯片的布线的封装半导体芯片及其制造方法
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Application No.: US13849248Application Date: 2013-03-22
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Publication No.: US09041186B2Publication Date: 2015-05-26
- Inventor: Ryuji Nomoto , Yoshiyuki Yoneda , Koichi Nakamura
- Applicant: FUJITSU SEMICONDUCTOR LIMITED
- Applicant Address: JP Yokohama
- Assignee: FUJITSU SEMICONDUCTOR LIMITED
- Current Assignee: FUJITSU SEMICONDUCTOR LIMITED
- Current Assignee Address: JP Yokohama
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2012-110099 20120511
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/02 ; H01L29/20 ; H01L21/56 ; H01L23/00 ; H01L23/495 ; H01L25/16 ; H01L25/00 ; H01L23/31 ; H01L23/13 ; H01L23/498
Abstract:
Disclosed is a semiconductor device including first and second semiconductor elements, first and second external connection terminals and a sealing member. The first external connection terminal is provided at a first surface of the first semiconductor element. The second semiconductor element is provided at a second surface side, that is at a side opposite to the first surface, of the first semiconductor element. The second external connection terminal is connected to the second semiconductor element, and the second external connection terminal is configured to be, together with the first external connection terminal, connected to a wiring board. The sealing member seals the first and second semiconductor elements and exposes a portion, that is configured to be connected to the wiring board, of the first external connection terminal and a portion, that is configured to be connected to the wiring board, of the second external connection terminal.
Public/Granted literature
- US20130299845A1 SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MODULE AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE Public/Granted day:2013-11-14
Information query
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