Invention Grant
- Patent Title: Power semiconductor package
- Patent Title (中): 功率半导体封装
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Application No.: US13300565Application Date: 2011-11-19
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Publication No.: US09041191B2Publication Date: 2015-05-26
- Inventor: Martin Standing
- Applicant: Martin Standing
- Applicant Address: US CA El Segundo
- Assignee: International Rectifier Corporation
- Current Assignee: International Rectifier Corporation
- Current Assignee Address: US CA El Segundo
- Agency: Farjami & Farjami LLP
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H01L23/043 ; H01L23/492 ; H01L23/13 ; H01L23/498 ; H01L23/00 ; H01L25/16
Abstract:
A semiconductor package that includes a conductive can, a power semiconductor device electrically and mechanically attached to the inside surface of the can, and an IC semiconductor device copackaged with the power semiconductor device inside the can.
Public/Granted literature
- US20120061725A1 Power Semiconductor Package Public/Granted day:2012-03-15
Information query
IPC分类:
