Invention Grant
- Patent Title: Phase changing on-chip thermal heat sink
-
Application No.: US14528343Application Date: 2014-10-30
-
Publication No.: US09041195B2Publication Date: 2015-05-26
- Inventor: Mattias E. Dahlstrom
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent David Cain
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L23/373 ; H01L49/02
Abstract:
A method of forming an on-chip heat sink includes forming a device on a substrate. The method also includes forming a plurality of insulator layers over the device. The method further includes forming a heat sink in at least one of the plurality of insulator layers and proximate to the device. The heat sink includes a reservoir of phase change material having a melting point temperature that is less than an upper limit of a design operating temperature of the chip.
Public/Granted literature
- US20150054131A1 PHASE CHANGING ON-CHIP THERMAL HEAT SINK Public/Granted day:2015-02-26
Information query
IPC分类:
