Invention Grant
- Patent Title: Integrated circuit structure having dies with connectors
- Patent Title (中): 具有连接器的集成电路结构
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Application No.: US14456463Application Date: 2014-08-11
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Publication No.: US09041225B2Publication Date: 2015-05-26
- Inventor: Jing-Cheng Lin , Cheng-Lin Huang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/00 ; H01L25/065
Abstract:
An embodiment is an integrated circuit structure including a first die attached to a second die by a first connector. The first connector includes a solder joint portion between a first nickel-containing layer and a second nickel-containing layer, a first copper-containing layer between the first nickel-containing layer and the solder joint portion, and a second copper-containing layer between the second nickel-containing layer and the solder joint portion.
Public/Granted literature
- US20140346672A1 Integrated Circuit Structure Having Dies with Connectors Public/Granted day:2014-11-27
Information query
IPC分类:
