Invention Grant
- Patent Title: Heat dissipating electromagnetic device arrangement
- Patent Title (中): 散热电磁装置布置
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Application No.: US13440063Application Date: 2012-04-05
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Publication No.: US09041502B2Publication Date: 2015-05-26
- Inventor: Ajmal Ansari , Nadir Sharaf , Slobodan Pavlovic
- Applicant: Ajmal Ansari , Nadir Sharaf , Slobodan Pavlovic
- Applicant Address: US MI Southfield
- Assignee: Lear Corporation
- Current Assignee: Lear Corporation
- Current Assignee Address: US MI Southfield
- Agency: Brooks Kushman P.C.
- Main IPC: H01F27/08
- IPC: H01F27/08 ; H01F27/10 ; H01F27/02 ; H01F27/22

Abstract:
An electromagnetic device arrangement includes a transformer assembly having a core, windings, and a housing disposed around at least a portion of the core and windings. An enclosure at least partially encloses the transformer assembly. The transformer assembly is mounted to a first portion of the enclosure such that heat is transferred from the transformer assembly to the first portion of the enclosure. A second portion of the enclosure has an extension extending therefrom such that the extension is placed in thermal contact with the transformer assembly to transfer heat from the transformer assembly to the extension.
Public/Granted literature
- US20130265129A1 HEAT DISSIPATING ELECTROMAGNETIC DEVICE ARRANGEMENT Public/Granted day:2013-10-10
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