Invention Grant
- Patent Title: Backside illuminated image sensors with stacked dies
- Patent Title (中): 背面照明图像传感器与堆叠的模具
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Application No.: US13972249Application Date: 2013-08-21
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Publication No.: US09041840B2Publication Date: 2015-05-26
- Inventor: Swarnal Borthakur , Scott Churchwell , Ulrich Boettiger , Marc Sulfridge , Andrew Perkins , Rick Lake
- Applicant: Semiconductor Components Industries, LLC
- Applicant Address: US AZ Phoenix
- Assignee: Semiconductor Components Industries, LLC
- Current Assignee: Semiconductor Components Industries, LLC
- Current Assignee Address: US AZ Phoenix
- Agency: Treyz Law Group
- Agent Kendall P. Woodruff
- Main IPC: H04N5/335
- IPC: H04N5/335 ; H04N5/225 ; H01L27/146

Abstract:
An image sensor unit may have a backside-illuminated imager and an image co-processor stacked together. The image co-processor may be mounted in a cavity in a permanent carrier. The permanent carrier may include fluid channels that allow cooling fluid to flow past the image co-process and past the imager, thereby removing excess heat generated by the image sensor unit during operation.
Public/Granted literature
- US20140055654A1 BACKSIDE ILLUMINATED IMAGE SENSORS WITH STACKED DIES Public/Granted day:2014-02-27
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