Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the semiconductor device
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14179787Application Date: 2014-02-13
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Publication No.: US09041875B2Publication Date: 2015-05-26
- Inventor: Setsuo Nakajima , Yasuyuki Arai
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Kanagawa-Ken
- Assignee: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Current Assignee: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Current Assignee Address: JP Kanagawa-Ken
- Agency: Husch Blackwell LLP
- Priority: JP11-228944 19990812
- Main IPC: G02F1/136
- IPC: G02F1/136 ; G02F1/1368 ; G02F1/1345 ; H01L29/49 ; H01L27/12 ; G02F1/1362

Abstract:
In a semiconductor device, a first interlayer insulating layer made of an inorganic material and formed on inverse stagger type TFTs, a second interlayer insulating layer made of an organic material and formed on the first interlayer insulating layer, and a pixel electrode formed in contact with the second interlayer insulating layer are disposed on a substrate, and an input terminal portion that is electrically connected to a wiring of another substrate is provided on an end portion of the substrate. The input terminal portion includes a first layer made of the same material as that of the gate electrode and a second layer made of the same material as that of the pixel electrode. With this structure, the number of photomasks used in the photolithography method can be reduced to 5.
Public/Granted literature
- US20140160390A1 Semiconductor Device and Method of Manufacturing the Semiconductor Device Public/Granted day:2014-06-12
Information query
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