Invention Grant
- Patent Title: Systems and methods for electrically connecting circuit devices for power distribution enclosures
- Patent Title (中): 用于电连接配电箱的电路设备的系统和方法
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Application No.: US13708181Application Date: 2012-12-07
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Publication No.: US09042084B2Publication Date: 2015-05-26
- Inventor: Steven E. Pever , Timothy J. Fink , Karthik Chandran Krishnamurthy , Raymond Jadin
- Applicant: Steven E. Pever , Timothy J. Fink , Karthik Chandran Krishnamurthy , Raymond Jadin
- Applicant Address: US GA Alpharetta
- Assignee: Siemens Industry, Inc.
- Current Assignee: Siemens Industry, Inc.
- Current Assignee Address: US GA Alpharetta
- Main IPC: H01H9/02
- IPC: H01H9/02 ; H01R4/34 ; H01H71/08 ; H01R4/56

Abstract:
A system is provided for a power distribution enclosure that includes an electronic circuit component. The system includes a conductive adapter having a head, and a circuit breaker base adapted for mounting to the power distribution enclosure. The circuit breaker base has an aperture adapted to receive the head of the conductive adapter. The head of the conductive adapter has a shape that substantially prevents rotation of the conductive adapter when the conductive adapter is inserted into the aperture. The conductive adapter is configured to draw away or absorb heat from the electronic circuit component and move the absorbed heat out of the power distribution enclosure. The circuit breaker base is adapted to substantially prevent heat from escaping from the conductive adapter into the power distribution enclosure. Numerous other aspects are provided.
Public/Granted literature
- US20140160638A1 SYSTEMS AND METHODS FOR ELECTRICALLY CONNECTING CIRCUIT DEVICES FOR POWER DISTRIBUTION ENCLOSURES Public/Granted day:2014-06-12
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