Invention Grant
- Patent Title: Power inverter including a power semiconductor module
- Patent Title (中): 功率逆变器包括功率半导体模块
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Application No.: US13992074Application Date: 2011-12-22
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Publication No.: US09042147B2Publication Date: 2015-05-26
- Inventor: Akira Ishii , Keisuke Fukumasu
- Applicant: Akira Ishii , Keisuke Fukumasu
- Applicant Address: JP Hitachinaka-shi
- Assignee: Hitachi Automotive Systems, Ltd.
- Current Assignee: Hitachi Automotive Systems, Ltd.
- Current Assignee Address: JP Hitachinaka-shi
- Agency: Crowell & Moring LLP
- Priority: JP2010-289948 20101227
- International Application: PCT/JP2011/079882 WO 20111222
- International Announcement: WO2012/090877 WO 20120705
- Main IPC: H02M1/00
- IPC: H02M1/00 ; H05K7/20 ; H02M1/12 ; H02M7/00

Abstract:
A power inverter includes a power semiconductor module that includes a power semiconductor device, a control circuit board that outputs a control signal used for controlling the power semiconductor device, a driver circuit board that outputs a driving signal used for driving the power semiconductor device, a conductive metal base plate arranged in a space between the driver circuit board and the control circuit board in which a fine and long opening portion is formed, wiring that connects the driver circuit board and the control circuit board through the opening portion and delivers the control signal to the driver circuit board, and an AC busbar that is arranged on a side opposite to the metal base plate through the driver circuit board and delivers an AC current output from the power semiconductor module to a drive motor. At least a portion of the AC busbar that faces the opening portion extends in a direction directly running in a longitudinal direction of the fine and long opening portion.
Public/Granted literature
- US20130265808A1 Power Inverter Public/Granted day:2013-10-10
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