Invention Grant
- Patent Title: Hard press rejection
- Patent Title (中): 硬压拒绝
-
Application No.: US14059200Application Date: 2013-10-21
-
Publication No.: US09043183B1Publication Date: 2015-05-26
- Inventor: Petro Ksondzyk , Jae-Bum Ahn
- Applicant: Cypress Semiconductor Corporation
- Applicant Address: US CA San Jose
- Assignee: Cypress Semiconductor Corporation
- Current Assignee: Cypress Semiconductor Corporation
- Current Assignee Address: US CA San Jose
- Main IPC: G01B5/26
- IPC: G01B5/26 ; G01N37/00 ; G06F3/041 ; G06F3/044

Abstract:
Techniques for hard press rejection are described herein. In an example embodiment, a touch area on a sensor array is determined, where the touch area corresponds to a detected object and is associated with multiple signal values. A slope value for the detected object is computed based on a ratio of a signal distribution value in the touch area to a metric indicating a size of the touch area with respect to the sensor array. The slope value is compared to a threshold in order to determine whether to accept or to reject the detected object, and the detected object is rejected based on the comparison.
Information query