Invention Grant
US09044406B2 Aqueous composition for enteric hard capsule, method of preparing enteric hard capsule, and enteric hard capsule prepared using the method
有权
用于肠溶硬胶囊的水性组合物,制备肠溶性硬胶囊的方法和使用该方法制备的肠溶性硬胶囊
- Patent Title: Aqueous composition for enteric hard capsule, method of preparing enteric hard capsule, and enteric hard capsule prepared using the method
- Patent Title (中): 用于肠溶硬胶囊的水性组合物,制备肠溶性硬胶囊的方法和使用该方法制备的肠溶性硬胶囊
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Application No.: US13378249Application Date: 2009-10-13
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Publication No.: US09044406B2Publication Date: 2015-06-02
- Inventor: Jin Ryul Son , Hyon Ho Baek , Sung Wan Lee , Min Gyu Song , Jae Uk Cha , Eun Hee Park
- Applicant: Jin Ryul Son , Hyon Ho Baek , Sung Wan Lee , Min Gyu Song , Jae Uk Cha , Eun Hee Park
- Applicant Address: KR
- Assignee: SAMSUNG FINE CHEMICALS CO., LTD.
- Current Assignee: SAMSUNG FINE CHEMICALS CO., LTD.
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2009-0085876 20090911
- International Application: PCT/KR2009/005870 WO 20091013
- International Announcement: WO2011/030952 WO 20110317
- Main IPC: B28B1/38
- IPC: B28B1/38 ; A61K9/48 ; A61K47/38

Abstract:
An aqueous composition for an enteric hard capsule, a method of preparing an enteric hard capsule, and an enteric hard capsule prepared using the method. The aqueous composition for an enteric hard capsule includes an enteric base material, a capsule forming aid, and a neutralizing agent. The method of preparing an enteric hard capsule includes: preparing an aqueous composition by dissolving an enteric base material, a capsule forming aid, and a neutralizing agent in water; preheating the aqueous composition to a temperature that is less than the gelation temperature for the aqueous composition; immersing a mold pin heated to a temperature that is greater than the gelation temperature for the aqueous composition into the aqueous composition; taking the mold pin out of the aqueous composition to obtain a film formed on the mold pin; and maintaining the film at a temperature that is equal to or greater than the gelation temperature for the aqueous composition for a predetermined period of time to fix the film on the mold pin and drying the film.
Public/Granted literature
Information query
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