Invention Grant
US09044593B2 Discontinuous conductive filler polymer-matrix composites for electromagnetic shielding
有权
用于电磁屏蔽的不连续导电填料聚合物基体复合材料
- Patent Title: Discontinuous conductive filler polymer-matrix composites for electromagnetic shielding
- Patent Title (中): 用于电磁屏蔽的不连续导电填料聚合物基体复合材料
-
Application No.: US11674992Application Date: 2007-02-14
-
Publication No.: US09044593B2Publication Date: 2015-06-02
- Inventor: Bernard Li , Chad Cai , Xingfu Chen
- Applicant: Bernard Li , Chad Cai , Xingfu Chen
- Applicant Address: US MN Minneapolis
- Assignee: MEDTRONIC, INC.
- Current Assignee: MEDTRONIC, INC.
- Current Assignee Address: US MN Minneapolis
- Agency: Withers & Keys, LLC
- Main IPC: A61B5/055
- IPC: A61B5/055 ; A61N1/05 ; A61N1/08

Abstract:
A medical electrical lead having a conductor assembly covered by an insulating layer, and a shield covering positioned adjacent or proximate to at least a portion of the insulating layer in order to shield the conductor assembly from one or more electromagnetic fields. The shield covering is formed of a polymer-matrix composite. The polymer-matrix composite includes a polymeric resin having discontinuous conductive fillers provided therein. The discontinuous conductive fillers include one or more of nano-sized metal structures and nano-sized non-metallic conductive structures. The nano-sized non-metallic conductive structures can have a coating formed of one or more metals. The nano-sized non-metallic conductive structures can be formed of carbon. In turn, the nano-sized non-metallic conductive structures can include one or more of carbon nanofibers, carbon filaments, carbon nanotubes, and carbon nanoflakes.
Public/Granted literature
- US20080195187A1 DISCONTINUOUS CONDUCTIVE FILLER POLYMER-MATRIX COMPOSITES FOR ELECTROMAGNETIC SHIELDING Public/Granted day:2008-08-14
Information query