Invention Grant
- Patent Title: Method of cladding diamond seeds
- Patent Title (中): 包覆金刚石种子的方法
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Application No.: US11916148Application Date: 2006-05-26
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Publication No.: US09044726B2Publication Date: 2015-06-02
- Inventor: Clint Guy Smallman , Geoffrey John Davies , Johannes Lodewikus Myburgh
- Applicant: Clint Guy Smallman , Geoffrey John Davies , Johannes Lodewikus Myburgh
- Applicant Address: LU Luxembourg
- Assignee: Element Six Abrasives S.A.
- Current Assignee: Element Six Abrasives S.A.
- Current Assignee Address: LU Luxembourg
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: ZA2005/04447 20050531
- International Application: PCT/IB2006/001370 WO 20060526
- International Announcement: WO2006/129155 WO 20061207
- Main IPC: B01J3/06
- IPC: B01J3/06 ; E21B10/36 ; E21B17/10 ; B32B5/16 ; B32B13/04 ; B24D3/02 ; B24D11/00 ; C09C1/68 ; C30B19/00 ; C30B28/06

Abstract:
The invention relates to a method for manufacture of diamond, the method including the steps of providing a first coating of solvent metal or solvent metal alloy on a diamond seed to create a coated diamond seed, situating the coated diamond seed adjacent a catalyst system comprising a solvent metal and/or a source of carbon, and subjecting the coated diamond seed and catalyst system to increased temperature wherein the melting point of the first coating is at least 20 deg C. below that of the catalyst system. The invention further relates to a compact comprising a plurality of diamond seeds wherein at least one seed includes a first coating comprising a solvent metal and/or solvent metal based alloy, the compact further comprising a catalyst system comprising a solvent metal and/or a source of carbon wherein the melting point of the first coating is at least 20 deg C. below that of the catalyst system.
Public/Granted literature
- US20080219914A1 Method of Cladding Diamond Seeds Public/Granted day:2008-09-11
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