Invention Grant
- Patent Title: Method for cleaning film formation apparatus and method for manufacturing semiconductor device
- Patent Title (中): 成膜装置的清洗方法及半导体装置的制造方法
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Application No.: US13680187Application Date: 2012-11-19
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Publication No.: US09044793B2Publication Date: 2015-06-02
- Inventor: Satoshi Toriumi , Makoto Furuno
- Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Nixon Peabody LLP
- Agent Jeffrey L. Costellia
- Priority: JP2011-254546 20111122
- Main IPC: H01L21/00
- IPC: H01L21/00 ; B08B7/04 ; H01L21/20 ; B08B7/00 ; C23C16/44 ; C23C16/02 ; C23C16/26 ; H01L29/16 ; H01M10/052 ; H01M4/131 ; H01M4/62 ; H01L29/66 ; H01L29/778 ; B82Y40/00

Abstract:
A method for cleaning a hot-wall type film formation apparatus having a batch processing system with industrially high mass productivity is provided. In the method, a carbon film deposited on an inner wall or the like of a reaction chamber of the apparatus is removed efficiently in a short time. To remove the carbon film deposited on the inner wall of the reaction chamber by a thermal CVD method, the reaction chamber is heated at a temperature higher than or equal to 700° C. and lower than or equal to 800° C., and oxygen is introduced into the reaction chamber.
Public/Granted literature
- US20130130476A1 METHOD FOR CLEANING FILM FORMATION APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2013-05-23
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