Scribing operations with reduced substrate heating can be provided by applying multiple optical pulses to a substrate within a time interval that is less than a material recombination time. Typically a series of pulses of durations of 5-200 ps with pulse energies of less than about 0.002 mJ can be applied at rates of about 1 MHz to about 30 MHz. Beam area and beam scanning are configured to provide substantial overlap so that material can be removed by cold ablation.