The aim is to regulate thickness on the optical axis in the production of wafer lenses. Disclosed is a wafer lens production method that is equipped with a dispensing process for dropping resin onto a molding die (64), an imprinting process for pressing either the molding die (64) or a glass substrate (2) toward the other, and a releasing process for releasing the glass substrate (2) from the molding die (64), and that repeats the processing from the dispensing process to the releasing process as a single cycle and successively forms resin lenses (4) on the glass substrate 2); wherein the height (A) of the non-lens area (6) surrounding the lenses (4) and the heights (B and C) of the glass substrate (2) are measured between the releasing process of a first cycle and the dispensing process of a second cycle, and the position of the molding die (64) is corrected for imprinting processes of the second cycle, on the basis of the heights (A-C).