Invention Grant
- Patent Title: Element substrate, printhead, and printing apparatus
- Patent Title (中): 元件基板,打印头和打印设备
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Application No.: US14300712Application Date: 2014-06-10
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Publication No.: US09044935B2Publication Date: 2015-06-02
- Inventor: Tomoko Kudo , Ryo Kasai , Nobuyuki Hirayama
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2013-138440 20130701
- Main IPC: B41J2/165
- IPC: B41J2/165 ; B41J2/045

Abstract:
An embodiment of this invention relates to an element substrate that implements size reduction of the element substrate and simplification of the arrangement as well as a highly-reliable print operation, a printhead using the same, and a printing apparatus including the printhead. In the element substrate according to this embodiment, the slope of a ramp wave is changed to generate a plurality of pulses using one reference voltage. The slope of the ramp wave can be changed by changing the mirror ratio or the capacitance of a comparator as well as by changing the resistance of a DAC.
Public/Granted literature
- US20150002566A1 ELEMENT SUBSTRATE, PRINTHEAD, AND PRINTING APPARATUS Public/Granted day:2015-01-01
Information query
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