Invention Grant
- Patent Title: Thermal sensing fluid ejection assembly and method
- Patent Title (中): 热传感器喷射组件及方法
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Application No.: US13818421Application Date: 2010-09-30
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Publication No.: US09044942B2Publication Date: 2015-06-02
- Inventor: Robert N. K. Browning , James Gardner , Eric Martin , Andrew L. Van Brocklin , Mark Hunter
- Applicant: Robert N. K. Browning , James Gardner , Eric Martin , Andrew L. Van Brocklin , Mark Hunter
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: Hewlett-Packard Patent Department
- International Application: PCT/US2010/050853 WO 20100930
- International Announcement: WO2012/044299 WO 20120405
- Main IPC: B41J29/393
- IPC: B41J29/393 ; B41J2/135 ; B41J2/14

Abstract:
A fluid ejection assembly includes a fluid slot formed in a die. The assembly also includes a nozzle column is formed along a side of the fluid slot. The assembly also includes a pair of thermal sensors to measure die temperature at the middle of the nozzle column and at a first end of the nozzle column.
Public/Granted literature
- US20130155142A1 THERMAL SENSING FLUID EJECTION ASSEMBLY AND METHOD Public/Granted day:2013-06-20
Information query
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