Invention Grant
- Patent Title: Liquid discharge head substrate, liquid discharge head, and method of manufacturing liquid discharge head substrate
- Patent Title (中): 排液头基板,排液头,以及液体排出头基板的制造方法
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Application No.: US14185760Application Date: 2014-02-20
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Publication No.: US09044948B2Publication Date: 2015-06-02
- Inventor: Maki Kato , Takahiro Matsui , Ichiro Saito
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon USA Inc. IP Division
- Priority: JP2013-033647 20130222
- Main IPC: B41J2/05
- IPC: B41J2/05 ; B41J2/16 ; B41J2/14

Abstract:
A liquid discharge head substrate includes a base; a pair of wiring lines; a heat-generating resistive layer, which is in contact with the wiring lines, and which has a portion corresponding to a space between the wiring lines, the portion forming an electrothermal transducer; an insulating layer which covers the heat-generating resistive layer and the wiring lines and which contains Si; a protective layer which covers at least one region of the insulating layer which contains Ir; and an intermediate layer which is placed between the insulating layer and the protective layer. The intermediate layer contains a material represented by the formula TaxSiyNz, where x is 5 atomic percent to 80 atomic percent, y is 3 atomic percent to 60 atomic percent, z is 10 atomic percent to 60 atomic percent.
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