Invention Grant
- Patent Title: Liquid ejecting apparatus
- Patent Title (中): 液体喷射装置
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Application No.: US14048366Application Date: 2013-10-08
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Publication No.: US09044957B2Publication Date: 2015-06-02
- Inventor: Hiroshige Owaki , Hiroyuki Hagiwara , Haruhisa Uezawa
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2012-227347 20121012
- Main IPC: B41J2/175
- IPC: B41J2/175 ; B41J2/18

Abstract:
A liquid ejecting apparatus includes a liquid ejecting head that ejects liquid in a manifold as liquid droplets from a nozzle opening; a supply path that supplies the liquid to the manifold; a pump unit that is disposed in the supply path and pumps the liquid; and a discharge path that discharges the liquid from the manifold, wherein a flow path resistance of the discharge path from the manifold is smaller than a flow path resistance of the supply path from the pump unit to the manifold.
Public/Granted literature
- US20140104348A1 Liquid Ejecting Apparatus Public/Granted day:2014-04-17
Information query
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