Invention Grant
US09045508B2 Phosphorus-containing oligomer and method for producing the same, curable resin composition and cured product of the same, and printed wiring board 有权
含磷低聚物及其制造方法,固化性树脂组合物及其固化物及印刷电路板

  • Patent Title: Phosphorus-containing oligomer and method for producing the same, curable resin composition and cured product of the same, and printed wiring board
  • Patent Title (中): 含磷低聚物及其制造方法,固化性树脂组合物及其固化物及印刷电路板
  • Application No.: US13932345
    Application Date: 2013-07-01
  • Publication No.: US09045508B2
    Publication Date: 2015-06-02
  • Inventor: Koji HayashiYutaka Satou
  • Applicant: DIC Corporation
  • Applicant Address: JP Tokyo
  • Assignee: DIC Corporation
  • Current Assignee: DIC Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Locke Lord LLP
  • Priority: JP2010-033449 20100218
  • Main IPC: C07F9/6574
  • IPC: C07F9/6574 C07F9/30 C07F9/6571 C08G79/04
Phosphorus-containing oligomer and method for producing the same, curable resin composition and cured product of the same, and printed wiring board
Abstract:
A phosphorus-containing oligomer is represented by formula (1): (R1 represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a phenyl group; n is the number of repeating units and an integer of 1 or more; X is a structural unit represented by structural formula (x1) or (x2) below; Y is a hydrogen atom, a hydroxyl group, or a structural unit represented by the formula (x1) or (x2); and, in the formula (x1) or (x2), R2, R3, R4, and R5 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, a phenyl group, or an aralkyl group), wherein the content of components whose n is 2 or more in the formula (1) is in the range of 5% to 90% in peak area in GPC measurement.
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