Invention Grant
- Patent Title: Toughened epoxy resin formulations
- Patent Title (中): 增韧环氧树脂配方
-
Application No.: US13499310Application Date: 2010-11-22
-
Publication No.: US09045585B2Publication Date: 2015-06-02
- Inventor: Stephanie L. Potisek , Mark B. Wilson
- Applicant: Stephanie L. Potisek , Mark B. Wilson
- Applicant Address: US MI Midland
- Assignee: Dow Global Technologies LLC
- Current Assignee: Dow Global Technologies LLC
- Current Assignee Address: US MI Midland
- Agent Joe R. Prieto
- International Application: PCT/US2010/057606 WO 20101122
- International Announcement: WO2011/063327 WO 20110526
- Main IPC: C08G59/24
- IPC: C08G59/24 ; C08L63/00 ; C09D163/00 ; C09J163/00 ; C08G59/22 ; C08L33/18 ; C09J131/04 ; C09J133/02 ; C09J133/06
Abstract:
A low viscosity toughened epoxy resin formulation including a divinylbenzene dioxide as a component in the formulation; wherein the formulation is useful for the manufacture of thermoset polymers.
Public/Granted literature
- US20120259042A1 TOUGHENED EPOXY RESIN FORMULATIONS Public/Granted day:2012-10-11
Information query
IPC分类:
