Invention Grant
- Patent Title: High thermal conductance thermal interface materials based on nanostructured metallic network-polymer composites
- Patent Title (中): 基于纳米结构金属网络聚合物复合材料的高导热热界面材料
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Application No.: US13357190Application Date: 2012-01-24
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Publication No.: US09045674B2Publication Date: 2015-06-02
- Inventor: Sushumna Iruvanti , Theodorian Borca-Tasciuc , Hafez Raeisi-Fard , Fengyuan Lai , Kamyar Pashayi , Joel Plawsky
- Applicant: Sushumna Iruvanti , Theodorian Borca-Tasciuc , Hafez Raeisi-Fard , Fengyuan Lai , Kamyar Pashayi , Joel Plawsky
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Joseph Petrokaltis, Esq.
- Main IPC: C09K5/06
- IPC: C09K5/06 ; C09K5/14 ; B82Y30/00
Abstract:
A composite structure provides high thermal conductivity as a thermal interface structure with a relatively low filler loading. The composite structure is formed by dispersing nanoparticles in a matrix at a low filler loading, and controlled sintering of the composite structure to induce agglomeration of the nanoparticles into a connected percolating thermally conducting network structure within the matrix.
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