Invention Grant
- Patent Title: Methods and systems for in-situ electroplating of electrodes
- Patent Title (中): 电极原位电镀方法及系统
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Application No.: US12136331Application Date: 2008-06-10
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Publication No.: US09045839B2Publication Date: 2015-06-02
- Inventor: Guillermo Daniel Zappi , Kenneth Paul Zarnoch , Christian Andrew Huntley , Dana Ray Swalla
- Applicant: Guillermo Daniel Zappi , Kenneth Paul Zarnoch , Christian Andrew Huntley , Dana Ray Swalla
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Fletcher Yoder, P.C.
- Main IPC: C25D17/00
- IPC: C25D17/00 ; C25D13/00 ; C25D11/00 ; C25D5/48 ; C25B1/10 ; C25B9/20 ; C25B11/00 ; C25B15/00 ; C25D5/08 ; C25D3/56

Abstract:
The present techniques provide electrochemical devices having enhanced electrodes with surfaces that facilitate operation, such as by formation of a porous nickel layer on an operative surface, particularly of the cathode. The porous metal layer increases the surface area of the electrode, which may result in increasing the efficiency of the electrochemical devices. The formation of the porous metal layer is performed in situ, that is, after the assembly of the electrodes into an electrochemical device. The in situ process offers a number of advantages, including the ability to protect the porous metal layer on the electrode surface from damage during assembly of the electrochemical device. The enhanced electrode and the method for its processing may be used in any number of electrochemical devices, and is particularly well suited for electrodes in an electrolyzer useful for splitting water into hydrogen and oxygen.
Public/Granted literature
- US20090301871A1 METHODS AND SYSTEMS FOR IN-SITU ELECTROPLATING OF ELECTRODES Public/Granted day:2009-12-10
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