Invention Grant
- Patent Title: Cryopump
- Patent Title (中): 冷冻者
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Application No.: US12585921Application Date: 2009-09-29
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Publication No.: US09046091B2Publication Date: 2015-06-02
- Inventor: Hidekazu Tanaka
- Applicant: Hidekazu Tanaka
- Applicant Address: JP Tokyo
- Assignee: Sumitomo Heavy Industries, Ltd.
- Current Assignee: Sumitomo Heavy Industries, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Fishman Stewart Yamaguchi PLLC
- Priority: JP2008-256514 20081001
- Main IPC: B01D8/00
- IPC: B01D8/00 ; F04B37/06 ; F04B37/08

Abstract:
A cryopump includes a second-stage cryopanel, a radiation shield that surrounds the second-stage cryopanel and has a shield opening, and a first-stage cryopanel provided in the shield opening. The first-stage cryopanel includes a first panel provided with opening regions thereon in a first distribution, and a second panel arranged closer to the second-stage cryopanel than the first panel and provided with opening regions thereon in a second distribution different from the first distribution when viewed in an arrangement direction of the first and second panels.
Public/Granted literature
- US20100077771A1 Cryopump Public/Granted day:2010-04-01
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