Invention Grant
US09046250B2 Circuit board assembly that includes plural LEDs electrically connected to underlying pads
有权
电路板组件，其包括电连接到下面的焊盘的多个LED
- Patent Title: Circuit board assembly that includes plural LEDs electrically connected to underlying pads
- Patent Title (中): 电路板组件，其包括电连接到下面的焊盘的多个LED
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Application No.: US14001013Application Date: 2012-02-28
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Publication No.: US09046250B2Publication Date: 2015-06-02
- Inventor: Pascal Pavao
- Applicant: Pascal Pavao
- Applicant Address: NL Eindhoven
- Assignee: KONINKLIJKE PHILIPS N.V.
- Current Assignee: KONINKLIJKE PHILIPS N.V.
- Current Assignee Address: NL Eindhoven
- Agent Yuliya R. Mathis
- International Application: PCT/IB2012/050916 WO 20120228
- International Announcement: WO2012/117345 WO 20120907
- Main IPC: H01L33/62
- IPC: H01L33/62 ; F21V15/04 ; H01L33/48 ; H05K1/18 ; F21V15/00 ; H05K13/00
Abstract:
Methods and apparatus related to a circuit board having a dielectric layer (140A/B, 240A/B, 340, 440, 340B, 440B) on the top and/or bottom thereof. A circuit board is provided having a core layer (110, 210, 310, 410) and at least one conductive layer (130A/B,132A/B, 230A/B, 232A/B, 330, 430) positioned on a first side of the core layer (110, 210, 310, 410). An outer dielectric layer (140A/B, 240A/B, 340, 440, 340B, 440B) is provided atop an outermost of the at least one conductive layer (130A/B, 132A/B, 230A/B, 232A/B, 330, 430). The dielectric layer (140A/B, 240A/B, 340, 440, 340B, 440B) includes a plurality of openings (334A, 336A, 445A) that provide access to at least one of connection pads and vias that are in electrical contact with one or more of the conductive layer(s) (130A/B, 132A/B, 230A/B, 232A/B, 330, 430).
Public/Granted literature
- US20130329427A1 CIRCUIT BOARD ASSEMBLY Public/Granted day:2013-12-12
Information query
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