Invention Grant
- Patent Title: Phase change type heat dissipating device
- Patent Title (中): 相变式散热装置
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Application No.: US13631764Application Date: 2012-09-28
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Publication No.: US09046305B2Publication Date: 2015-06-02
- Inventor: Rung-An Chen
- Applicant: Rung-An Chen
- Applicant Address: TW New Taipei
- Assignee: Foxconn Technology Co., Ltd.
- Current Assignee: Foxconn Technology Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: TW101120756 20120608
- Main IPC: H01L23/427
- IPC: H01L23/427 ; H05K7/20 ; F28D15/02 ; F28D20/02

Abstract:
A phase change type heat dissipating device for dissipating heat from a heat generating component includes a casing, a working medium received in the casing and a heat pipe connected to the casing. The heat pipe includes an evaporator section and a condenser section. The working medium is electrically insulated and phase change material, and represents solid state at normal temperature. The heat generating component is received in the casing, and the evaporator section of the heat pipe extends into the casing and contacts the working medium.
Public/Granted literature
- US20130327502A1 PHASE CHANGE TYPE HEAT DISSIPATING DEVICE Public/Granted day:2013-12-12
Information query
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