Invention Grant
- Patent Title: Modular apparatus and method for attaching multiple devices
- Patent Title (中): 用于连接多个设备的模块化设备和方法
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Application No.: US13524327Application Date: 2012-06-15
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Publication No.: US09046426B1Publication Date: 2015-06-02
- Inventor: Robert S Okojie
- Applicant: Robert S Okojie
- Applicant Address: US DC Washington
- Assignee: The United States of America as Represented by the Administrator of National Aeronautics and Space Administration
- Current Assignee: The United States of America as Represented by the Administrator of National Aeronautics and Space Administration
- Current Assignee Address: US DC Washington
- Agent Robert H. Earp, III
- Main IPC: G01L7/00
- IPC: G01L7/00
Abstract:
A modular apparatus for attaching sensors and electronics is disclosed. The modular apparatus includes a square recess including a plurality of cavities and a reference cavity such that a pressure sensor can be connected to the modular apparatus. The modular apparatus also includes at least one voltage input hole and at least one voltage output hole operably connected to each of the plurality of cavities such that voltage can be applied to the pressure sensor and received from the pressure sensor.
Information query
