Invention Grant
US09046432B2 Sensor device, sensor module, force sensing apparatus, and robot
有权
传感器装置，传感器模块，力传感装置和机器人
- Patent Title: Sensor device, sensor module, force sensing apparatus, and robot
- Patent Title (中): 传感器装置，传感器模块，力传感装置和机器人
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Application No.: US13719985Application Date: 2012-12-19
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Publication No.: US09046432B2Publication Date: 2015-06-02
- Inventor: Hideaki Oka , Toshiyuki Kamiya , Hiroki Kawai
- Applicant: Seiko Epson Corporation
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2011-278968 20111220
- Main IPC: G01L1/22
- IPC: G01L1/22 ; G01L5/16 ; B25J9/16 ; G01L5/22 ; G01L1/16
Abstract:
A sensor device includes a package, a sensor element that is disposed in the package, and a lid that seals the package. The lid includes a flexible portion that surrounds the vicinity of the sensor element in a plan view.
Public/Granted literature
- US20130152701A1 SENSOR DEVICE, SENSOR MODULE, FORCE SENSING APPARATUS, AND ROBOT Public/Granted day:2013-06-20
Information query
