Invention Grant
- Patent Title: Method for manufacturing pressure sensing device
- Patent Title (中): 制造压力传感装置的方法
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Application No.: US13710718Application Date: 2012-12-11
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Publication No.: US09046549B2Publication Date: 2015-06-02
- Inventor: Yoshihiro Higashi , Michiko Hara , Hideaki Fukuzawa , Yoshihiko Fuji , Hiromi Yuasa , Tomohiko Nagata
- Applicant: Yoshihiro Higashi , Michiko Hara , Hideaki Fukuzawa , Yoshihiko Fuji , Hiromi Yuasa , Tomohiko Nagata
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2012-075148 20120328
- Main IPC: G01R3/00
- IPC: G01R3/00 ; G01L9/16 ; G01L1/12 ; G01L9/00 ; A61B5/021

Abstract:
According to one embodiment, a method for manufacturing a pressure sensing device includes preparing a sensor unit and a mounting substrate. The sensor unit includes: a membrane body; and an element unit provided on the membrane body. The element unit includes: a first electrode; a second electrode; and a first magnetic layer provided between the first electrode and the second electrode and having magnetization in a first direction. The mounting substrate includes: a base; a first electrode pad provided on the base; and a second electrode pad provided on the base and provided apart from the first electrode pad. The method further includes joining the first electrode pad to the first electrode while heated, and joining the second electrode pad to the second electrode while heated, with an external magnetic field along the first direction applied to the sensor unit.
Public/Granted literature
- US20130255069A1 METHOD FOR MANUFACTURING PRESSURE SENSING DEVICE Public/Granted day:2013-10-03
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