Invention Grant
- Patent Title: Production method of scintillator array
- Patent Title (中): 闪烁体阵列的制作方法
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Application No.: US13810124Application Date: 2012-04-24
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Publication No.: US09046615B2Publication Date: 2015-06-02
- Inventor: Akira Shigekawa , Hideo Nitta , Satoshi Shiota
- Applicant: Akira Shigekawa , Hideo Nitta , Satoshi Shiota
- Applicant Address: JP Tokyo
- Assignee: HITACHI METALS, LTD.
- Current Assignee: HITACHI METALS, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2011-096962 20110425
- International Application: PCT/JP2012/060980 WO 20120424
- International Announcement: WO2012/147747 WO 20121101
- Main IPC: H01S4/00
- IPC: H01S4/00 ; G01T1/20

Abstract:
A method for producing a dual-array-type scintillator array, comprising forming first and second scintillator sticks having cell portions by providing first and second scintillator substrates with pluralities of grooves and cutting them in directions perpendicular to the grooves; arranging and fixing plural sets of the first and second scintillator sticks with the cell portions downward on a support plate via spacers; removing base portions from the first and second scintillator sticks by grinding to form first and second cell arrays comprising the first and second cells each arranged in line; forming an integral resin-cured assembly by filling the grooves and gaps of the first and second cell arrays with a resin for a reflector, curing the resin, and then removing the support plate; and cutting a resin layer between the first and second cell arrays in adjacent sets to divide the resin-cured assembly to sets of the first and second cell arrays.
Public/Granted literature
- US20130125385A1 PRODUCTION METHOD OF SCINTILLATOR ARRAY Public/Granted day:2013-05-23
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