Invention Grant
US09047432B2 System and method for validating stacked dies by comparing connections
有权
通过比较连接验证堆叠模具的系统和方法
- Patent Title: System and method for validating stacked dies by comparing connections
- Patent Title (中): 通过比较连接验证堆叠模具的系统和方法
-
Application No.: US13770158Application Date: 2013-02-19
-
Publication No.: US09047432B2Publication Date: 2015-06-02
- Inventor: Ashok Mehta , Stanley John , Kai-Yuan Ting , Sandeep Kumar Goel , Chao-Yang Yeh
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Agent Steven E. Koffs
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A system comprises a processor-implemented tool configured to generate a layout of an integrated circuit (IC) die. At least one non-transitory machine readable storage medium includes a first portion encoded with a first gate-level description of first and second circuit patterns to be formed on first and second integrated circuit (IC) dies, respectively, and a second portion encoded with a second gate level description of the first and second circuit patterns received from the processor implemented tool. The second gate level description includes power and ground ports, and the first gate level description does not include power and ground ports. A processor-implemented first verification module is provided for comparing the first and second gate level descriptions and outputting a verified second gate-level description of the first and second circuit patterns.
Public/Granted literature
- US20130167095A1 STACKED DIE INTERCONNECT VALIDATION Public/Granted day:2013-06-27
Information query