Invention Grant
US09047548B2 Semiconductor chip, transponder and method of manufacturing a transponder
有权
半导体芯片，应答器和制造应答器的方法
- Patent Title: Semiconductor chip, transponder and method of manufacturing a transponder
- Patent Title (中): 半导体芯片，应答器和制造应答器的方法
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Application No.: US12303705Application Date: 2007-05-16
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Publication No.: US09047548B2Publication Date: 2015-06-02
- Inventor: Christian Scherabon , Anton Salfener , Wolfgang Steinbauer , Joachim Heinz Schober
- Applicant: Christian Scherabon , Anton Salfener , Wolfgang Steinbauer , Joachim Heinz Schober
- Applicant Address: NL Eindhoven
- Assignee: NXP B.V.
- Current Assignee: NXP B.V.
- Current Assignee Address: NL Eindhoven
- Priority: EP06115080 20060607
- International Application: PCT/IB2007/051884 WO 20070516
- International Announcement: WO2007/141686 WO 20071213
- Main IPC: H01L21/02
- IPC: H01L21/02 ; G06K19/077 ; H01L23/64 ; H01L23/00 ; H01L23/498
Abstract:
A semiconductor chip (1, 91) for a transponder (3, 93) comprises a chip substrate (4) with a surface (5), chip terminals (6, 7) arranged on the surface (5), and a passivation layer (22) covering the surface (5) and completely covering the chip terminals (6, 7), so that an antenna (2, 30) with antenna terminals (24, 25) can be attached to the chip (1, 91) above the chip terminals (6, 7), so that the chip terminals (6, 7), the passivation layer (22) and the antenna terminal (24, 25) form first capacitors.
Public/Granted literature
- US20100224959A1 Semiconductor Chip, Transponder and Method of Manufacturing a Transponder Public/Granted day:2010-09-09
Information query
IPC分类:
