Invention Grant
- Patent Title: Head assembly and disk device provided with the same
- Patent Title (中): 头部组件和磁盘设备配备相同
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Application No.: US14300732Application Date: 2014-06-10
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Publication No.: US09047896B1Publication Date: 2015-06-02
- Inventor: Masaya Kudo , Yasutaka Sasaki , Takuma Kido
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Tokyo
- Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee Address: JP Tokyo
- Agency: Knobbe, Martens, Olson & Bear LLP
- Priority: JP2014-031426 20140221
- Main IPC: G11B5/58
- IPC: G11B5/58 ; G11B5/55 ; G11B5/48

Abstract:
According to one embodiment, a head gimbal assembly includes a support plate, a wiring member including a thin metallic plate, an insulating layer and a conductive layer, the wiring member including a tongue portion located on a convex portion of the support plate, a proximal end portion fixed onto the support plate, and a bridge portion bridged between the tongue portion and the proximal end portion and including a inflection point with respect to a height direction of warping, a magnetic head attached to the tongue portion, and a piezoelectric element bonded to the bridge portion at a section between the proximal end portion and the inflection point.
Information query
IPC分类: