Invention Grant
- Patent Title: Temperature compensation of conductive bridge memory arrays
- Patent Title (中): 导电桥式存储器阵列的温度补偿
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Application No.: US14256925Application Date: 2014-04-19
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Publication No.: US09047983B2Publication Date: 2015-06-02
- Inventor: Roy E. Scheuerlein , George Samachisa
- Applicant: SANDISK 3D LLC
- Applicant Address: US CA Milpitas
- Assignee: SANDISK 3D LLC
- Current Assignee: SANDISK 3D LLC
- Current Assignee Address: US CA Milpitas
- Agency: Vierra Magen Marcus LLP
- Main IPC: G11C7/04
- IPC: G11C7/04 ; G11C7/00 ; G11C5/06 ; G11C11/56 ; G11C7/12 ; G11C8/08 ; G11C16/34 ; G11C29/02 ; G11C13/00 ; G11C5/14 ; G11C5/02 ; G11C29/12

Abstract:
Methods for operating a semiconductor memory array including dynamically adjusting control line voltages (e.g., unselected word line or unselected bit line voltages) based on one or more array conditions associated with the semiconductor memory array are described. The one or more array conditions may include a temperature associated with the semiconductor memory array or a particular number of write cycles associated with the semiconductor memory array. In some embodiments, an intermediate voltage is generated based on the one or more array conditions and applied to the unselected word lines and the unselected bit lines of the semiconductor memory array. The one or more intermediate voltages may be generated such that a first voltage difference across unselected memory cells sharing a selected word line is different from a second voltage difference across other unselected memory cells sharing a selected bit line based on the one or more array conditions.
Public/Granted literature
- US20140226393A1 TEMPERATURE COMPENSATION OF CONDUCTIVE BRIDGE MEMORY ARRAYS Public/Granted day:2014-08-14
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