Invention Grant
- Patent Title: Bond wire transformer
- Patent Title (中): 接线变压器
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Application No.: US13310293Application Date: 2011-12-02
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Publication No.: US09048020B2Publication Date: 2015-06-02
- Inventor: David Angel Calvillo Cortes , Leo C. N. De Vreede , Mark Pieter van der Heijden
- Applicant: David Angel Calvillo Cortes , Leo C. N. De Vreede , Mark Pieter van der Heijden
- Applicant Address: NL Eindhoven
- Assignee: NXP, B.V.
- Current Assignee: NXP, B.V.
- Current Assignee Address: NL Eindhoven
- Priority: EP10193629 20101203; EP10194851 20101214
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F21/02 ; H01F19/04 ; H03F1/02 ; H03F3/217

Abstract:
A bond wire transformer comprises a plurality of primary bond wires coupled in parallel; and a plurality of secondary bond wires coupled in parallel, each secondary bond wire being spaced apart from and oriented relative to a corresponding primary bond wire so as to achieve a desired mutual inductance between the corresponding primary and secondary bond wires, thereby providing magnetic coupling between the primary and secondary bond wires.
Public/Granted literature
- US20120139640A1 BOND WIRE TRANSFORMER Public/Granted day:2012-06-07
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