Integrated circuit with on chip planar diode and CMOS devices

Invention Grant

US09048108B2 Integrated circuit with on chip planar diode and CMOS devices 有权

Title translation: 集成电路与片上平面二极管和CMOS器件

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Patent Title: Integrated circuit with on chip planar diode and CMOS devices
Patent Title (中): 集成电路与片上平面二极管和CMOS器件
Application No.: US13478080

Application Date: 2012-05-22
Publication No.: US09048108B2

Publication Date: 2015-06-02
Inventor: Kangguo Cheng , Ali Khakifirooz , Pranita Kulkarni , Ghavam G. Shahidi
Applicant: Kangguo Cheng , Ali Khakifirooz , Pranita Kulkarni , Ghavam G. Shahidi
Applicant Address: US NY Armonk
Assignee: International Business Machines Corporation
Current Assignee: International Business Machines Corporation
Current Assignee Address: US NY Armonk
Agent Ido Tuchman; Vazken Alexanian
Main IPC: H01L21/8238
IPC: H01L21/8238 ; H01L27/06

Integrated circuit with on chip planar diode and CMOS devices

Abstract:

An electrical circuit, planar diode, and method of forming a diode and one or more CMOS devices on the same chip. The method includes electrically isolating a portion of a substrate in a diode region from other substrate regions. The method also includes recessing the substrate in the diode region. The method further includes epitaxially forming in the diode region a first doped layer above the substrate and epitaxially forming in the diode region a second doped layer above the first doped layer.

Abstract(Chinese):

在同一芯片上形成二极管和一个或多个CMOS器件的电路，平面二极管和方法。该方法包括将二极管区域中的衬底的一部分与其它衬底区域电隔离。该方法还包括使二极管区域中的衬底凹陷。该方法还包括在二极管区域中外延形成在衬底上方的第一掺杂层，并在二极管区域中外延地形成第一掺杂层上方的第二掺杂层。

Public/Granted literature

US20130313651A1 INTEGRATED CIRCUIT WITH ON CHIP PLANAR DIODE AND CMOS DEVICES Public/Granted day:2013-11-28

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70	.由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77	..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78	...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）
H01L21/82	....制造器件，例如每一个由许多元件组成的集成电路
H01L21/822	.....衬底是采用硅工艺的半导体的（H01L21/8258优先）
H01L21/8232	......场效应工艺
H01L21/8234	.......MIS工艺
H01L21/8238	........互补场效应晶体管，例如CMOS