Invention Grant
- Patent Title: Semiconductor device, module and system each including the same, and method for manufacturing the semiconductor device
- Patent Title (中): 各自包括的半导体器件,模块和系统以及半导体器件的制造方法
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Application No.: US13719037Application Date: 2012-12-18
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Publication No.: US09048109B2Publication Date: 2015-06-02
- Inventor: In Seung Chung
- Applicant: SK Hynix Inc.
- Applicant Address: KR Icheon
- Assignee: SK HYNIX INC.
- Current Assignee: SK HYNIX INC.
- Current Assignee Address: KR Icheon
- Priority: KR10-2012-0031096 20120327
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/423 ; H01L27/108 ; H01L21/768

Abstract:
A barrier for preventing a bridge between adjacent storage node contacts is formed below a bit line located between the bit line contacts, so that a contact region between each storage node contact and an active region is increased in size. The semiconductor device includes a device isolation film defining an active region, a bit line contact coupling the active region to a bit line, and a barrier formed below the bit line located between the bit line contacts.
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