Invention Grant
US09048109B2 Semiconductor device, module and system each including the same, and method for manufacturing the semiconductor device 有权
各自包括的半导体器件,模块和系统以及半导体器件的制造方法

  • Patent Title: Semiconductor device, module and system each including the same, and method for manufacturing the semiconductor device
  • Patent Title (中): 各自包括的半导体器件,模块和系统以及半导体器件的制造方法
  • Application No.: US13719037
    Application Date: 2012-12-18
  • Publication No.: US09048109B2
    Publication Date: 2015-06-02
  • Inventor: In Seung Chung
  • Applicant: SK Hynix Inc.
  • Applicant Address: KR Icheon
  • Assignee: SK HYNIX INC.
  • Current Assignee: SK HYNIX INC.
  • Current Assignee Address: KR Icheon
  • Priority: KR10-2012-0031096 20120327
  • Main IPC: H01L29/06
  • IPC: H01L29/06 H01L29/423 H01L27/108 H01L21/768
Semiconductor device, module and system each including the same, and method for manufacturing the semiconductor device
Abstract:
A barrier for preventing a bridge between adjacent storage node contacts is formed below a bit line located between the bit line contacts, so that a contact region between each storage node contact and an active region is increased in size. The semiconductor device includes a device isolation film defining an active region, a bit line contact coupling the active region to a bit line, and a barrier formed below the bit line located between the bit line contacts.
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