Invention Grant
- Patent Title: Semiconductor image pickup device
- Patent Title (中): 半导体图像拾取装置
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Application No.: US13232260Application Date: 2011-09-14
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Publication No.: US09048156B2Publication Date: 2015-06-02
- Inventor: Hidetoshi Koike
- Applicant: Hidetoshi Koike
- Applicant Address: JP Tokyo
- Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2010-251801 20101110
- Main IPC: H01L31/062
- IPC: H01L31/062 ; H01L27/146
Abstract:
According to one embodiment, a semiconductor image pickup device includes a pixel area and a non-pixel area. The device includes a first photoelectric conversion element formed in the pixel area, a first transistor formed in the pixel area and connected to the first photoelectric conversion element, a second photoelectric conversion element formed in the non-pixel area, a second transistor formed in the non-pixel area and connected to the second photoelectric conversion element, a metal wire formed at least in the non-pixel area, a first cap layer formed on the metal wire to prevent diffusion of metal contained in the metal wire, and a dummy via wire formed in the non-pixel area and penetrating the first cap layer.
Public/Granted literature
- US20120112253A1 SEMICONDUCTOR IMAGE PICKUP DEVICE Public/Granted day:2012-05-10
Information query
IPC分类:
