Invention Grant
- Patent Title: Semiconductor device with isolation insulating layer containing air gap
- Patent Title (中): 半导体器件隔离绝缘层包含气隙
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Application No.: US14514358Application Date: 2014-10-14
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Publication No.: US09048158B2Publication Date: 2015-06-02
- Inventor: Tatsuya Kunikiyo
- Applicant: RENESAS ELECTRONICS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: McDermott Will & Emery LLP
- Priority: JP2011-040092 20110225
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L27/146

Abstract:
A semiconductor device having a solid-state image sensor which can prevent inter-pixel crosstalk more reliably. The device includes: a semiconductor substrate having a main surface; a first conductivity type impurity layer located over the main surface of the substrate; a photoelectric transducer including a first conductivity type impurity region and a second conductivity type impurity region which are joined to each other over the first conductivity type impurity layer; and transistors which configure a unit pixel including the photoelectric transducer and are electrically coupled to the photoelectric transducer. At least part of the area around the photoelectric transducer in a plan view contains an air gap and also has an isolation insulating layer for electrically insulating the photoelectric transducer and a photoelectric transducer adjacent to it from each other. The isolation insulating layer abuts on the top surface of the first conductivity type impurity layer.
Public/Granted literature
- US20150028404A1 SEMICONDUCTOR DEVICE WITH ISOLATION INSULATING LAYER CONTAINING AIR GAP Public/Granted day:2015-01-29
Information query
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