Invention Grant
- Patent Title: Power semiconductor package
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Application No.: US12283204Application Date: 2008-09-10
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Publication No.: US09048196B2Publication Date: 2015-06-02
- Inventor: Martin Standing , Robert J. Clarke
- Applicant: Martin Standing , Robert J. Clarke
- Applicant Address: US CA El Segundo
- Assignee: International Rectifier Corporation
- Current Assignee: International Rectifier Corporation
- Current Assignee Address: US CA El Segundo
- Agency: Farjami & Farjami LLP
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/498 ; H01L23/31 ; H01L23/482 ; H01L23/00
Abstract:
A power semiconductor package that includes a semiconductor die having at least two power electrodes and a conductive clip electrically and mechanically coupled to each power electrode.
Public/Granted literature
- US20090008804A1 Power semiconductor package Public/Granted day:2009-01-08
Information query
IPC分类:
