Invention Grant
US09048221B2 Device having electrodes formed from bumps with different diameters
有权
具有由具有不同直径的凸块形成的电极的装置
- Patent Title: Device having electrodes formed from bumps with different diameters
- Patent Title (中): 具有由具有不同直径的凸块形成的电极的装置
-
Application No.: US13671033Application Date: 2012-11-07
-
Publication No.: US09048221B2Publication Date: 2015-06-02
- Inventor: Yu Hasegawa , Mitsuaki Katagiri
- Applicant: PS4 Luxco S.a.r.l.
- Applicant Address: LU Luxembourg
- Assignee: PS4 Luxco S.a.r.l.
- Current Assignee: PS4 Luxco S.a.r.l.
- Current Assignee Address: LU Luxembourg
- Priority: JP2011-251560 20111117
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/48 ; H01L21/56 ; H01L25/065 ; H01L23/31 ; H01L23/00
Abstract:
A device has a first substrate having a first surface; a first electrode pad arranged on the first surface of the first substrate; a first insulator film provided on the first surface of the first substrate so that the first electrode pad is exposed; a first bump electrode provided on the first electrode pad and having a first diameter; and a second bump electrode provided on the first insulator film and having a second diameter smaller than the first diameter.
Public/Granted literature
- US20130127048A1 DEVICE Public/Granted day:2013-05-23
Information query
IPC分类:
